The next generation of Moto X is currently being reported to come with a cooling heat pipe.
We have seen how Motorola's "Moto X Play" did well when it was introduced this year, so it's safe to say that the company should find it hard to do a follow up on that for next year. However, it looks like Motorola is up for the challenge and they may already be about to release the phone's next gen model. There has even been a leak that was said to be the Moto X next-gen's internals.
What is probably the most interesting feature this leak has shown us is its heat pipe that shall keep the phone's processor cool while the device is working hard. This may not be a groundbreaking move especially when the "Microsoft Lumia 950 XL" and "Sony Xperia Z5 Premium" already used a similar technique to address the overheating issues the Snapdragon 810 SoC processor has been known for, but still, it's good to know that Motorola also works hard to provide the best quality phone internals to its users.
This move should be appreciated especially when the company most likely wouldn't use the infamous Snapdragon 810 in their next phone. They may simply be just playing it safe so users are saved from heating smartphones. With this step taken by the company, we can say that Motorola Moto X next-gen is nearer to perfection compared to its earlier siblings.
As per the leaked image, the phone may come with metal unibody. This rumored look is actually also in line with the previous leak of the phone's back side, with the camera and speakers being in the same position in the two separate leaks.
Still, the leaks may just be a presentation of prototypes and the final product may be different. And by the way, the final name of the phone isn't official yet and can be anything, though it is most likely to begin with "Moto X".