iPhone 7 Rumors: Intel 7360 LTE Modem Chip, Liquidmetal Exclusive Qualities for Upcoming Device?

The iPhone 6s and 6s Plus have just been released and yet the internet is already full of rumors about the next generation iPhone. One of the latest buzz is that the iPhone 7 is said to be having an Intel chip.

Not too long ago, Apple experienced a remarkable weekend when the latest iPhone was released. It was so remarkable that it had broken its own previous record for the number of units sold. The latest iPhone has sold 13 million units compared to its predecessor, 10 million, as reported by New York Times.

iPhone 6s and 6s Plus sales was so big that people are talking about the next iPhone to be released and that it might be loaded with the upcoming Intel modem chip. It is also said that Intel has a thousand of its employees currently working on the Intel 7360 LTE modem chip to make it possible for the iPhone 7 to have it, VentureBeat reported.

iPhone 7 rumors, however, says that there is also a possibility that the Cupertino-based tech giant may still use the current Qualcomm chipset, which means that the next generation iPhone may have two available chipset. According to rumors, no contract has been drawn yet between the two tech giants. Intel's resulting work will definitely have a profound effect on this matter, as the report continued.

Many modern day smartphones are equipped with a Qualcomm chipset. They are currently the king of this arena. That is also the reason why Intel needs to successfully close the deal with Apple to set its place in the mobile chip provider playing field.

iPhone 7 is also said to bear another patent filed by Apple Inc. This time, the iPhone 7 may utilize Liquidmetal for its hook and loop design. The iPhone 6s and 6s Plus is currently using the 7000 Series aluminium, which is more sturdy than the previous generation.

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