Samsung Galaxy S7 is now making fans excited, despite the latest release of Samsung Galaxy S6 Edge+ and Note 5.
Samsung Galaxy S7 rumored release will be in the first quarter next year, probably in February or January of 2016. Leaks are now beginning to come in to reveal small details of the forthcoming Samsung smartphone.
Samsung Galaxy S7 reports have disclosed that the device shall have a body built from magnesium alloy, which means that the forthcoming flagship smartphone will not just be lightweight, but will have more security against overheating as well.
Samsung has also been reported on developing Turtle Glass panel for their own products, replacing Corning Gorilla Glass which they have long been used. This rumored panel is believed to be much tougher than Gorilla Glass. If indeed Samsung is enhancing the display panel of their smartphone, then it may be possible that they are going to present their latest technology in the forthcoming flagship device.
Samsung Galaxy S7 is said to come to China and the US and is going to get S7 furnished with a Snapdragon CPU, according to a report by Reuters. It was also revealed that the Qualcomm's latest processor has also been developed to use minimal power and is possible to have some overheating problems, Phone Arena reported. The processor of Snapdragon 820 may possibly be matched with Adreno 530 GPU.
Samsung Galaxy S7 will still arrive in some other countries, but the device will be equipped with Samsung's Exynos chipset. According to a rumored benchmark test, Samsung is going to use their new processor Exynos 8890, which was labeled as the Mongoose or M1.
Samsung Galaxy S7 spokeswoman has declined to give any comment on these reports' validity. So it must be pointed out that the reports remain only as speculations. Additional information will pop up when the official release of Galaxy S7 closes in.
