Sony Xperia Z5 is having a dual heat pipe to address the overheating issues.
Sony Xperia Z5 premium will be equipped with a Snapdragon 810 by Qualcomm. Sony, on the other hand, is aware of the overheating issue with these chips and to be able to provide a solution, they have installed a dual heat pipe.
Sony Xperia Z5, loaded with a Snapdragon 810, may soon experience problems. With the additional 4K display, it will try to crank out every processing power the system can from the processor, which will result to overheating.
Sony Xperia Z5 leaked photo has been circulating online via Weibo, a Chinese social media site, showing that the Japanese tech giant used a dual heat pipe to overcome the issue. If the photo is true, this additional piece of hardware will disperse the heat faster, making it less prone to overheating issue, according to an article by G for Games.
Judging from the image posted, a white substance can also be clearly seen on top of what might be the processor. This substance seems to be a thermal paste, which is commonly used on PC processors to help with heat dissipation.
Sony Xperia Z5, theoretically speaking with regards to the setup of the Premium, can disperse heat properly since this is a pretty common practice for overheating. On the other hand, this is still dependent on how a user will manage the smartphone, the article continued.
The other soon-to-be released models in the series, the Z5 and Z5 compact is not affected by this concern. Though the models have been unveiled at IFA 2015 in Berlin, there is still no exact date when the new smartphones from Sony will hit the retailers.
Sony on its Xperia Z5 Premium's lack of an actual unit to test the workaround still proves nothing. So it is still a waiting game for everybody.
